School of Mechanical Engineering, Sungkyunkwan University (SKKU)

$\color{0A97AC}{\textsf{\huge{Hello!}}}$

I'm Changhwan Song, a post-doctoral scholar at Multi-Scale Heat Transfer Lab (MHeat Lab), which is directed by Prof. Jungwan Cho, at Sungkyunkwan University (SKKU).

My research focuses on thermal management of wide-bandgap (WBG) and ultra-wide-bandgap (UWBG) electronic devices, including GaN, Ga2O3, and AlxGa1-xN, as well as the packaging of MOSFETs, MODFETs, and HEMTs based on these materials. I am currently working on coupled electro-thermal-fluidic co-modeling of these devices using commercial TCAD and finite element (FE) tools.

$\color{0A97AC}{\textsf{Research Interest}}$

• WBG/UWBG based electronic devices
• Micro/nano-scale heat transfer
• Electro-thermal-fluidic co-modeling

$\color{0A97AC}{\textsf{\huge{Contact}}}$

$\color{0A97AC}{\textsf{Tel}}$ +82-10-5132-7540

$\color{0A97AC}{\textsf{Email}}$ ch.song@g.skku.edu

$\color{0A97AC}{\textsf{Website}}$ mheat.skku.edu

$\color{0A97AC}{\textsf{Linkedin}}$ url.kr/iznvcw

$\color{0A97AC}{\textsf{Google Scholar}}$ url.kr/hn54j6

$\color{0A97AC}{\textsf{Address}}$ Room #306, Engineering Bldg.1, 2066 Seobu-ro, Suwon-si, Gyeonggi-do, Republic of Korea (16419)

$\color{0A97AC}{\textsf{\huge{Education}}}$

$\color{0A97AC}{\textsf{2020.03 - 2025.02}}$ ****Mechanical Engineering, Sungkyunkwan University Ph.D.

$\color{0A97AC}{\textsf{2018.03

• 2020.02}}$ ****Mechanical Engineering, Kyung Hee University M.S.

$\color{0A97AC}{\textsf{2012.03

• 2018.02}}$ ****Mechanical Engineering, Kyung Hee University B.S.

$\color{0A97AC}{\textsf{\huge{Work Experience}}}$

$\color{0A97AC}{\textsf{2025.03 - 2025.06}}$ ****Post-Doctoral Scholar, Sungkyunkwan University

$\color{0A97AC}{\textsf{\huge{Teaching Experience}}}$

$\color{0A97AC}{\textsf{2020.06 - 2023.02}}$ **“**Co-op Education for Mechanical Engineering”, Sungkyunkwan University, Undergraduate Course

$\color{0A97AC}{\textsf{2018.03 - 2019.12}}$ ****“Mechanical Engineering Experiment”, Kyung Hee University, Undergraduate Course

$\color{0A97AC}{\textsf{\huge{Military Service}}}$

$\color{0A97AC}{\textsf{2013.07 - 2015.07}}$ ****Military Service, Republic of Korea Air Force (ROKAF), K-9 Officer, Honorable Discharge

$\color{0A97AC}{\textsf{\huge{Awards and Honors}}}$

$\color{0A97AC}{\textsf{SKKU Innovation Research Fellowship}}$Sungkyunkwan University, October 2023

$\color{0A97AC}{\textsf{SKKU Innovation Research Fellowship}}$Sungkyunkwan University, April 2021

$\color{0A97AC}{\textsf{\huge{Skills}}}$

$\color{0A97AC}{\textsf{Device Modeling}}$ ****Silvaco ATHENA & ATLAS (TCAD), COMSOL Multiphysics (FE)

$\color{0A97AC}{\textsf{Programming}}$ ****MATLAB

$\color{0A97AC}{\textsf{Graphic Design}}$ ****Microsoft PowerPoint, Adobe Illustrator & Photoshop

$\color{0A97AC}{\textsf{etc.}}$ ****Military Dog Trainer, Live Sound Engineering

$\color{0A97AC}{\textsf{\huge{Research Projects}}}$

$\color{0A97AC}{\textsf{Thermal Management of High-Power Semiconductors}}$

• AlGaN/GaN HEMT: Investigation of bias-dependent self-heating and strategies for reducing device-level thermal resistance in high-power AlGaN/GaN HEMTs.
• β-Ga2O3 MOSFETs & AlxGa1-xN HEMTs: Optimization of cooling approaches to lower device junction temperature in UWBG devices.

$\color{0A97AC}{\textsf{Development of Coupled Electro-Thermal-Fluidic Model}}$

• Development of a coupled electro-thermal-fluidic model by integrating bias-dependent heat generation analysis (electrical modeling), thermal transport and cooling strategies (thermal modeling), and enhanced heat dissipation pathways (fluidic modeling).

$\color{0A97AC}{\textsf{\huge{Journal Publications}}}$

† : These authors contributed equally to this work.

• Changhwan Song, Hyeonjin Nam, Jisu Kim, Daeyoung Kong, Hyoungsoon Lee, and Jungwan Cho, “Thermal management of GaN HEMTs through electro-thermal modeling”, 2025 24th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), Under Review.
• Taeyoung Kim,† Changhwan Song,† Sung Il Park, Seong Hyuk Lee, Bong Jae Lee, and Jungwan Cho, “Modeling and analyzing near-junction thermal transport in high-heat-flux GaN devices heterogeneously integrated with diamond”, International Communications in Heat and Mass Transfer, 143, 106682, 2023.
• Taeyeon Kim,† Sung Il Park,† Changhwan Song, Hyoungsoon Lee, and Jungwan Cho, “Fundamental conduction cooling limits for sub-1 μm Ga2O3 devices integrated with diamond”, International Journal of Heat and Mass Transfer, 191, 122864, 2022.
• Changhwan Song, Jihyun Kim, and Jungwan Cho, “The effect of GaN epilayer thickness on the near-junction thermal resistance of GaN-on-diamond devices”, International Journal of Heat and Mass Transfer, 158, 119992, 2020.
• Changhwan Song, Jihyun Kim, Hyoungsoon Lee, and Jungwan Cho, “Fundamental limits for near-junction conduction cooling of high power GaN-on-diamond devices”, Solid State Communications, 295, 12-15, 2019.

$\color{0A97AC}{\textsf{\huge{Conference Presentations}}}$

$\color{0A97AC}{\textsf{International Conferences}}$ (Oral session #3, Poster session #2)

[Oral Presentations]

• Changhwan Song, Hyeonjin Nam, Jisu Kim, Daeyoung Kong, Hyoungsoon Lee, and Jungwan Cho, “Thermal management of GaN HEMTs through electro-thermal modeling”, The 24th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), Dallas, TX, USA, May 2025.

• Changhwan Song, Hyeonjin Nam, Jisu Kim, Sukwon Choi, and Jungwan Cho, “Thermal management of GaN-on-diamond HEMTs through electro-thermal modeling”, The 11th Asia-Pacific Workshop on Widegap Semiconductors (APWS), Busan, Korea, October 2024.

• Changhwan Song, Sukwon Choi, and Jungwan Cho, “Thermal management of GaN-on-diamond HEMTs through electro-thermal modeling”, The American Society of Mechanical Engineers (ASME) International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK), San Diego, CA, USA, October 2023.

  [Poster Presentations]

• Changhwan Song, Sukwon Choi, and Jungwan Cho, “Thermal management of GaN-on-diamond HEMTs through electro-thermal modeling”, The American Society of Mechanical Engineers (ASME) International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK), San Diego, CA, USA, October 2023.

• Changhwan Song, Jihyun Kim, and Jungwan Cho, “The effect of GaN epilayer thickness on the near-junction thermal resistance of GaN-on-diamond devices”, The American Society of Mechanical Engineers (ASME) International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK), Online, October 2020.

$\color{0A97AC}{\textsf{Domestic Conferences}}$ (Oral session #7, Poster session #3)

[Oral Presentations]

• Changhwan Song, Jisu Kim, Hyeonjin Nam, and Jungwan Cho, “Thermal management strategies for GaN-on-diamond HEMTs through electro-thermal modeling”, The Korean Society of Mechanical Engineers (KSME) Thermal Engineering Division, Jeju, Korea, April 2025.

• Changhwan Song, Jisu Kim, and Jungwan Cho, “Device-level thermal management of GaN HEMTs through electro-thermal modeling”, The 32nd Korean Conference on Semiconductors (KCS), Jeongseon, Korea, January 2025.

• Changhwan Song, Sukwon Choi, and Jungwan Cho, “Thermal management of GaN HEMTs through electro-thermal modeling”, The 31st Korean Conference on Semiconductors (KCS), Gyeongju, Korea, January 2024.

• Changhwan Song and Jungwan Cho, “Thermal management of high-power GaN-on-diamond devices through electro-thermal modeling”, The Korean Society of Mechanical Engineers (KSME) Thermal Engineering Division, Busan, Korea, April 2023.

• Changhwan Song, Taeyoung Kim, and Jungwan Cho, “Thermal performance comparison of high-power GaN-on-diamond and GaN-on-BAs devices”, The Korean Society of Mechanical Engineers (KSME) Thermal Engineering Division, Gyeongju, Korea, April 2022.

• Changhwan Song, Taeyoung Kim, and Jungwan Cho, “Detailed thermal modeling guideline for GaN-on-diamond high electron mobility transistors”, The Korean Society of Mechanical Engineers (KSME) Thermal Engineering Division, Jeju, Korea, May 2021.

• Changhwan Song, Jihyun Kim, and Jungwan Cho, “GaN layer thickness effects on the near-junction thermal resistance of GaN-on-diamond devices”, The Korean Society of Mechanical Engineers (KSME) Thermal Engineering Division, Busan, Korea, May 2019.

  [Poster Presentations]

• Changhwan Song, Jihyun Kim, and Jungwan Cho, “Near-junction thermal management of high-power GaN-on-diamond transistors”, The Korean Society of Mechanical Engineers (KSME) Annual Meeting, Jeju, Korea, November 2019.

• Changhwan Song, Jihyun Kim, and Jungwan Cho, “Analysis of near-junction thermal resistance of high-power GaN transistors”, The Korean Society of Mechanical Engineers (KSME) Annual Meeting, Jeongseon, Korea, December 2018.

• Changhwan Song and Jungwan Cho, “Near-junction thermal transport in high-power GaN transistors”, The Korean Society of Mechanical Engineers (KSME) Thermal Engineering Division, Jeju, Korea, April 2018.