Dr. Changhwan Song | Post-Doctoral Scholar

School of Mechanical Engineering, Sungkyunkwan University (SKKU)

$\color{0A97AC}{\textsf{\huge{Hello!}}}$

I'm Changhwan Song, a post-doctoral scholar at Multi-Scale Heat Transfer Lab (MHeat Lab), which is directed by Prof. Jungwan Cho, at Sungkyunkwan University (SKKU).

My research focuses on thermal management of wide-bandgap (WBG) and ultra-wide-bandgap (UWBG) electronic devices, including GaN, Ga2O3, and AlxGa1-xN, as well as the packaging of MOSFETs, MODFETs, and HEMTs based on these materials. I am currently working on coupled electro-thermal-fluidic co-modeling of these devices using commercial TCAD and finite element (FE) tools.

$\color{0A97AC}{\textsf{Research Interest}}$

WBG/UWBG based electronic devices
Micro/nano-scale heat transfer
Electro-thermal-fluidic co-modeling

$\color{0A97AC}{\textsf{\huge{Contact}}}$

$\color{0A97AC}{\textsf{Tel}}$ +82-10-5132-7540

$\color{0A97AC}{\textsf{Email}}$ [email protected]

$\color{0A97AC}{\textsf{Website}}$ mheat.skku.edu

$\color{0A97AC}{\textsf{Linkedin}}$ url.kr/iznvcw

$\color{0A97AC}{\textsf{Google Scholar}}$ url.kr/hn54j6

$\color{0A97AC}{\textsf{Address}}$ Room #306, Engineering Bldg.1, 2066 Seobu-ro, Suwon-si, Gyeonggi-do, Republic of Korea (16419)

$\color{0A97AC}{\textsf{\huge{Education}}}$

$\color{0A97AC}{\textsf{2020.03 - 2025.02}}$ ****Mechanical Engineering, Sungkyunkwan University Ph.D.

$\color{0A97AC}{\textsf{2018.03

2020.02}}$ ****Mechanical Engineering, Kyung Hee University M.S.

$\color{0A97AC}{\textsf{2012.03

2018.02}}$ ****Mechanical Engineering, Kyung Hee University B.S.

$\color{0A97AC}{\textsf{\huge{Work Experience}}}$

$\color{0A97AC}{\textsf{2025.03 - 2025.06}}$ ****Post-Doctoral Scholar, Sungkyunkwan University

$\color{0A97AC}{\textsf{\huge{Teaching Experience}}}$

$\color{0A97AC}{\textsf{2020.06 - 2023.02}}$ **“**Co-op Education for Mechanical Engineering”, Sungkyunkwan University, Undergraduate Course

$\color{0A97AC}{\textsf{2018.03 - 2019.12}}$ ****“Mechanical Engineering Experiment”, Kyung Hee University, Undergraduate Course

$\color{0A97AC}{\textsf{\huge{Military Service}}}$

$\color{0A97AC}{\textsf{2013.07 - 2015.07}}$ ****Military Service, Republic of Korea Air Force (ROKAF), K-9 Officer, Honorable Discharge

$\color{0A97AC}{\textsf{\huge{Awards and Honors}}}$

$\color{0A97AC}{\textsf{SKKU Innovation Research Fellowship}}$Sungkyunkwan University, October 2023

$\color{0A97AC}{\textsf{SKKU Innovation Research Fellowship}}$Sungkyunkwan University, April 2021

$\color{0A97AC}{\textsf{\huge{Skills}}}$

$\color{0A97AC}{\textsf{Device Modeling}}$ ****Silvaco ATHENA & ATLAS (TCAD), COMSOL Multiphysics (FE)

$\color{0A97AC}{\textsf{Programming}}$ ****MATLAB

$\color{0A97AC}{\textsf{Graphic Design}}$ ****Microsoft PowerPoint, Adobe Illustrator & Photoshop

$\color{0A97AC}{\textsf{etc.}}$ ****Military Dog Trainer, Live Sound Engineering

$\color{0A97AC}{\textsf{\huge{Research Projects}}}$

$\color{0A97AC}{\textsf{Thermal Management of High-Power Semiconductors}}$

AlGaN/GaN HEMT: Investigation of bias-dependent self-heating and strategies for reducing device-level thermal resistance in high-power AlGaN/GaN HEMTs.
β-Ga2O3 MOSFETs & AlxGa1-xN HEMTs: Optimization of cooling approaches to lower device junction temperature in UWBG devices.

$\color{0A97AC}{\textsf{Development of Coupled Electro-Thermal-Fluidic Model}}$

Development of a coupled electro-thermal-fluidic model by integrating bias-dependent heat generation analysis (electrical modeling), thermal transport and cooling strategies (thermal modeling), and enhanced heat dissipation pathways (fluidic modeling).

$\color{0A97AC}{\textsf{\huge{Journal Publications}}}$

† : These authors contributed equally to this work.

Changhwan Song, Hyeonjin Nam, Jisu Kim, Daeyoung Kong, Hyoungsoon Lee, and Jungwan Cho, “Thermal management of GaN HEMTs through electro-thermal modeling”, 2025 24th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), Under Review.
Taeyoung Kim,† Changhwan Song,† Sung Il Park, Seong Hyuk Lee, Bong Jae Lee, and Jungwan Cho, “Modeling and analyzing near-junction thermal transport in high-heat-flux GaN devices heterogeneously integrated with diamond”, International Communications in Heat and Mass Transfer, 143, 106682, 2023.
Taeyeon Kim,† Sung Il Park,† Changhwan Song, Hyoungsoon Lee, and Jungwan Cho, “Fundamental conduction cooling limits for sub-1 μm Ga2O3 devices integrated with diamond”, International Journal of Heat and Mass Transfer, 191, 122864, 2022.
Changhwan Song, Jihyun Kim, and Jungwan Cho, “The effect of GaN epilayer thickness on the near-junction thermal resistance of GaN-on-diamond devices”, International Journal of Heat and Mass Transfer, 158, 119992, 2020.
Changhwan Song, Jihyun Kim, Hyoungsoon Lee, and Jungwan Cho, “Fundamental limits for near-junction conduction cooling of high power GaN-on-diamond devices”, Solid State Communications, 295, 12-15, 2019.

$\color{0A97AC}{\textsf{\huge{Conference Presentations}}}$

$\color{0A97AC}{\textsf{International Conferences}}$ (Oral session #2, Poster session #2)

[Oral Presentations]

Changhwan Song, Hyeonjin Nam, Jisu Kim, Sukwon Choi, and Jungwan Cho, “Thermal management of GaN-on-diamond HEMTs through electro-thermal modeling”, The 11th Asia-Pacific Workshop on Widegap Semiconductors (APWS), Busan, Korea, October 2024.
Changhwan Song, Sukwon Choi, and Jungwan Cho, “Thermal management of GaN-on-diamond HEMTs through electro-thermal modeling”, The American Society of Mechanical Engineers (ASME) International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK), San Diego, CA, USA, October 2023.

[Poster Presentations]
Changhwan Song, Sukwon Choi, and Jungwan Cho, “Thermal management of GaN-on-diamond HEMTs through electro-thermal modeling”, ASME InterPACK, San Diego, CA, USA, October 2023.
Changhwan Song, Jihyun Kim, and Jungwan Cho, “The effect of GaN epilayer thickness on the near-junction thermal resistance of GaN-on-diamond devices”, ASME InterPACK, Online, October 2020.

$\color{0A97AC}{\textsf{Domestic Conferences}}$ (Oral session #6, Poster session #3)

[Oral Presentations]

Changhwan Song, Jisu Kim, and Jungwan Cho, “Device-level thermal management of GaN HEMTs through electro-thermal modeling”, The 32nd Korean Conference on Semiconductors (KCS), Jeongseon, Korea, January 2025.
Changhwan Song, Sukwon Choi, and Jungwan Cho, “Thermal management of GaN HEMTs through electro-thermal modeling”, The 31st KCS, Gyeongju, Korea, January 2024.
Changhwan Song and Jungwan Cho, “Thermal management of high-power GaN-on-diamond devices through electro-thermal modeling”, The Korean Society of Mechanical Engineers (KSME) Thermal Engineering Division, Busan, Korea, April 2023.
Changhwan Song, Taeyoung Kim, and Jungwan Cho, “Thermal performance comparison of high-power GaN-on-diamond and GaN-on-BAs devices”, KSME Thermal Engineering Division, Gyeongju, Korea, April 2022.
Changhwan Song, Taeyoung Kim, and Jungwan Cho, “Detailed thermal modeling guideline for GaN-on-diamond high electron mobility transistors”, KSME Thermal Engineering Division, Jeju, Korea, May 2021.
Changhwan Song, Jihyun Kim, and Jungwan Cho, “GaN layer thickness effects on the near-junction thermal resistance of GaN-on-diamond devices”, KSME Thermal Engineering Division, Busan, Korea, May 2019.

[Poster Presentations]
Changhwan Song, Jihyun Kim, and Jungwan Cho, “Near-junction thermal management of high-power GaN-on-diamond transistors”, KSME Annual Meeting, Jeju, Korea, November 2019.
Changhwan Song, Jihyun Kim, and Jungwan Cho, “Analysis of near-junction thermal resistance of high-power GaN transistors”, KSME Annual Meeting, Jeongseon, Korea, December 2018.
Changhwan Song and Jungwan Cho, “Near-junction thermal transport in high-power GaN transistors”, KSME Thermal Engineering Division, Jeju, Korea, April 2018.