School of Mechanical Engineering, Sungkyunkwan University (SKKU)

$\color{0A97AC}{\textsf{\huge{Hello!}}}$

I'm Changhwan Song, a doctoral course student at Multi-Scale Heat Transfer Lab (MHeat Lab), which is directed by Prof. Jungwan Cho, at Sungkyunkwan University (SKKU).

My research focuses on thermal management of wide-bandgap and ultra-wide-bandgap (GaN, β-Ga2O3, and AlxGa1-xN) electronic devices and the packaging of MOSFETs, MODFETs, and HEMTs based on these materials. Currently working on the research of coupled electro-thermal-fluidic co-modeling of these devices using TCAD and FEM packages.

$\color{0A97AC}{\textsf{Research Interest}}$

• WBG/UWBG-based MOSFETs, MODFETs, and HEMTs
• Micro/Nano-scale heat transfer
• Electro-thermal-fluidic co-modeling (Silvaco ATLAS & COMSOL Multiphysics)

$\color{0A97AC}{\textsf{\huge{Education}}}$

$\color{0A97AC}{\textsf{2020.03 - Present}}$ ****Mechanical Engineering, Sungkyunkwan University Ph.D.

$\color{0A97AC}{\textsf{2018.03

• 2020.02}}$ ****Mechanical Engineering, Kyung Hee University M.S.

$\color{0A97AC}{\textsf{2012.03

• 2018.02}}$ ****Mechanical Engineering, Kyung Hee University B.S.

$\color{0A97AC}{\textsf{\huge{Work Experience}}}$

$\color{0A97AC}{\textsf{2013.07 - 2015.07}}$ ****Military Service, Republic of Korea Air Force (ROKAF), K-9 Officer, Honorable Discharge

$\color{0A97AC}{\textsf{\huge{Skillset}}}$

$\color{0A97AC}{\textsf{Device Modeling}}$ ****Silvaco ATHENA & ATLAS (TCAD), COMSOL Multiphysics (FEM)

$\color{0A97AC}{\textsf{Programming}}$ ****MATLAB

$\color{0A97AC}{\textsf{Graphic Design}}$ ****Microsoft PowerPoint, Adobe Illustrator & Photoshop

$\color{0A97AC}{\textsf{\huge{Awards}}}$

$\color{0A97AC}{\textsf{SKKU Innovation Research Fellowship}}$Sungkyunkwan University, October 2023

$\color{0A97AC}{\textsf{SKKU Innovation Research Fellowship}}$Sungkyunkwan University, April 2021

$\color{0A97AC}{\textsf{\huge{Contact}}}$

$\color{0A97AC}{\textsf{Tel}}$ +82-10-5132-7540

$\color{0A97AC}{\textsf{Email}}$ [email protected]

$\color{0A97AC}{\textsf{Website}}$ mheat.skku.edu

$\color{0A97AC}{\textsf{Linkedin}}$ url.kr/iznvcw

$\color{0A97AC}{\textsf{Google Scholar}}$ url.kr/hn54j6

$\color{0A97AC}{\textsf{Address}}$ Room #306, Engineering Bldg.1, 2066 Seobu-ro, Suwon-si, Gyeonggi-do, Republic of Korea (16419)

$\color{0A97AC}{\textsf{\huge{Research Projects}}}$

$\color{0A97AC}{\textsf{Thermal Management}}$

• AlGaN/GaN HEMT: Analysis to reduce the near-junction thermal resistance of high-power AlGaN/GaN HEMTs.
• β-Ga2O3 MOSFETs & AlxGa1-xN HEMTs: Comparison of bottom/top/double-side cooling approaches to reduce operating temperature to desired level.

$\color{0A97AC}{\textsf{Coupled Electro-Thermal-Fluidic Co-Modeling}}$

• Development of coupled electro-thermal-fluidic model through two-way coupling of 2D electro-thermal models (Silvaco ATLAS) and 3D FEM thermal-fluidic models (COMSOL Multiphysics).

$\color{0A97AC}{\textsf{\huge{Journal Publications}}}$

† : These authors contributed equally to this work.

• Taeyoung Kim,† Changhwan Song,† Sung Il Park, Seong Hyuk Lee, Bong Jae Lee, and Jungwan Cho, “Modeling and analyzing near-junction thermal transport in high-heat-flux GaN devices heterogeneously integrated with diamond”, International Communications in Heat and Mass Transfer, 143, 106682, 2023.
• Taeyeon Kim,† Sung Il Park,† Changhwan Song, Hyoungsoon Lee, and Jungwan Cho, “Fundamental conduction cooling limits for sub-1 μm Ga2O3 devices integrated with diamond”, International Journal of Heat and Mass Transfer, 191, 122864, 2022.
• Changhwan Song, Jihyun Kim, and Jungwan Cho, “The effect of GaN epilayer thickness on the near-junction thermal resistance of GaN-on-diamond devices”, International Journal of Heat and Mass Transfer, 158, 119992, 2020.
• Changhwan Song, Jihyun Kim, Hyoungsoon Lee, and Jungwan Cho, “Fundamental limits for near-junction conduction cooling of high power GaN-on-diamond devices”, Solid State Communications, 295, 12-15, 2019.

$\color{0A97AC}{\textsf{\huge{Conference Presentations}}}$

• Hongju Mun, Taeyoung Kim, Changhwan Song, Jongwon Baek, and Jungwan Cho, "Parameter sensitivity study for optimizing near-junction thermal management of β-Ga2O3 MOSFETs”, KSME Thermal Engineering Division, Jeju, Korea, April 2024.
• Jisu Kim, Jongwon Baek, Changhwan Song, and Jungwan Cho, “Thermal transport in ultrawide bandgap AlxGa1-xN semiconductor devices”, KSME Thermal Engineering Division, Jeju, Korea, April 2024.
• Changhwan Song, Sukwon Choi, and Jungwan Cho, “Thermal management of GaN HEMTs through electro-thermal modeling”, The Korean Conference on Semiconductors (KCS), Gyeongju, Korea, January 2024.
• Changhwan Song, Sukwon Choi, and Jungwan Cho, “Thermal management of GaN-on-diamond HEMTs through electro-thermal modeling”, ASME InterPACK, San Diego, CA, USA, October 2023.
• Changhwan Song and Jungwan Cho, “Thermal management of high-power GaN-on-diamond devices through electro-thermal modeling”, KSME Thermal Engineering Division, Busan, Korea, April 2023.
• Taeyeon Kim, Sung Il Park, Changhwan Song, and Jungwan Cho, “Evaluation of near-junction cooling limits of heteroepitaxial Ga2O3-on-diamond devices”, KSME Thermal Engineering Division, Gyeongju, Korea, April 2022.
• Changhwan Song, Taeyoung Kim, and Jungwan Cho, “Thermal performance comparison of high-power GaN-on-diamond and GaN-on-BAs devices”, KSME Thermal Engineering Division, Gyeongju, Korea, April 2022.
• Taeyeon Kim, Sung Il Park, Changhwan Song, and Jungwan Cho, “Thermal management strategies for β-Ga2O3 heterojunction semiconductor devices, KSME Annual Meeting, Gwangju, Korea, November 2021.
• Taeyoung Kim, Changhwan Song, and Jungwan Cho, “Thermal modeling strategies for high-power GaN electronics on diamond”, KSME Annual Meeting, Gwangju, Korea, November 2021.
• Changhwan Song, Taeyoung Kim, and Jungwan Cho, “Detailed thermal modeling guideline for GaN-on-diamond high electron mobility transistors”, KSME Thermal Engineering Division, Jeju, Korea, May 2021.
• Changhwan Song, Jihyun Kim, and Jungwan Cho, “The effect of GaN epilayer thickness on the near-junction thermal resistance of GaN-on-diamond devices”, The American Society of Mechanical Engineers (ASME) International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK), Online, October 2020.
• Changhwan Song, Jihyun Kim, and Jungwan Cho, “Near-junction thermal management of high-power GaN-on-diamond transistors”, KSME Annual Meeting, Jeju, Korea, November 2019.
• Changhwan Song, Jihyun Kim, and Jungwan Cho, “GaN layer thickness effects on the near-junction thermal resistance of GaN-on-diamond devices”, KSME Thermal Engineering Division, Busan, Korea, May 2019.
• Changhwan Song, Jihyun Kim, and Jungwan Cho, “Analysis of near-junction thermal resistance of high-power GaN transistors”, KSME Annual Meeting, Jeongseon, Korea, December 2018.
• Changhwan Song and Jungwan Cho, “Near-junction thermal transport in high-power GaN transistors”, The Korean Society of Mechanical Engineers (KSME) Thermal Engineering Division, Jeju, Korea, April 2018.